[PEDA] Thermal Impedance of Copper Areas

[Brian Guralnick]

The soldier filled holes act as a thermal conductor.  The idea is to draw 
heat away from the component, spreading it out more efficiently to the rest 
of the PCB.

____________
Brian G.


----- Original Message ----- 
From: "Gerhard Fiedler" <gelists at gmail.com>
To: "Protel EDA Discussion List" <PEDA at techservinc.com>
Sent: Saturday, July 29, 2006 2:39 PM
Subject: Re: [PEDA] Thermal Impedance of Copper Areas


> On 2006-07-28 13:32:24, you wrote:
>
>> If you are trying to get that last little bit of extra thermal cooling, 
>> if
>> your PCB has multiple layers, flood fill the layers under the component 
>> with
>> coper.  Also, if you can add a grid of pads around the component which 
>> may
>> be waved/filled with soldier, this can also help.
>
> Couldn't it be that open holes (not filled with solder) are effective, too
> -- in horizontal PCBs? They'd possibly create some additional convection.
>
> Gerhard
>
>
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