[PEDA] Thermal Impedance of Copper Areas

[Gerhard Fiedler]

On 2006-07-28 13:32:24, you wrote:

> If you are trying to get that last little bit of extra thermal cooling, if 
> your PCB has multiple layers, flood fill the layers under the component with 
> coper.  Also, if you can add a grid of pads around the component which may 
> be waved/filled with soldier, this can also help.

Couldn't it be that open holes (not filled with solder) are effective, too
-- in horizontal PCBs? They'd possibly create some additional convection.

Gerhard